Coverage › CVE-2023-33063
CVE-2023-33063 Unmapped
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
- Vendor / product
- Qualcomm — Multiple Chipsets
- Description (CISA)
- Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
- Added to KEV
- 2023-12-05
- Due date
- 2023-12-26
- Required action
- Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
- Known ransomware use
- Unknown
- Forensic triage (CISA)
- No
- CWE
- CWE-416
- CISA notes
- This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
https://nvd.nist.gov/vuln/detail/CVE-2023-33063 - Elsewhere
- cve.org · NVD · CISA KEV · JSON
ATT&CK techniques
No public source states how this vulnerability is exploited in ATT&CK terms.
The only authoritative CVE → ATT&CK mapping in the open — CTID's Mappings Explorer, pinned to a KEV snapshot of 2025-07-28 and ATT&CK 16.1 — does not include CVE-2023-33063. CISA's catalogue carries no technique field. kevmap does not infer techniques from the CWE (CWE-416) — here is why — and does not guess.
This page will change state automatically if a mapping is published. What is shown above is everything CISA publishes about the entry.